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 产品详情
                    产品详情
                
	
	l Facilitates AC analysis to assess voltage distribution across ground planes
	l Establishes power delivery network (PDN) guidelines for IC packages and boards
	l Evaluates electromagnetic coupling between geometries to enable better component, via, and decap placement
	l Extracts frequency-dependent S, Z, and Y parameters for package and board modeling for subsequent time domain SSN simulation
	l Anticipates energy leaks with near-field ration display
	l Assesses decoupling capacitor strategies and verifies placement effects Enables broadband modeling including accurate DC performance characterization
	l Integrates seamlessly with 3D solutions for IC packages and boards
	l Distributed computing option accelerates analysis time (additional license required)
	l Strong HSPICE flow support
l Optimized for flows with Allegro X Design Platform, Allegro X Advanced Package Designer Platform, as well as Mentor, Zuken, and Altium flows, accepting a mix of CAD databases where needed for multi-structure design support
 成功案例
                    成功案例