Key Benefits

Save Design Time and Computing Resources

l Design Insight

Minimizes late-stage design iterations, costly implementations, engineering delays, product iterations, and field failures by enabling designers to perform thermal simulations early in the design phase

l Greater Productivity

Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy

l Electrothermal Reliability

Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations

l Complete System Analysis

Multiphysics technology combines FEA for solid structures with CFD for fluids to enable detailed analysis of the entire system

Features

ü Transient as well as steady-state analysis enables accurate electrical-thermal co-simulation to analyze transient, steady-state, and heat conduction in complicated solid structures

ü Provides ready access to operating temperature data for reliability and performance studies

ü Import and analyze large package and PCB designs in full detail with no input simplification and perform joule-heating, stress, and warpage analysis

ü Accurately simulate thermal-induced stress and strain in solid allows designers to pinpoint problem areas and avoid costly product reliability issues

ü Advanced finite-element method (FEM) meshing technology makes meshing any complex system fast and easy

Applications

Your Most Complex Thermal Challenges — Solved

SoCs

Floorplan optimization, performance analysis using voltage/frequency corners under thermal constraints, and accurate temperature sensor location.

MMICs

Solutions for RF power amplifier (PA) and monolithic microwave IC (MMIC) designs and RF PCBs and modules that support electrothermal analysis through model information sourced from circuit design software, including existing MMIC design data and geometries such as layout, material properties, and power-source values from RF simulation.

IC Packages

Transient electrothermal co-simulations to accurately identify temperature and current density issues in packages.

PCB Modules

Electrothermal co-simulation for full PCB design without any simplification and calculation of IR drop by calculating on the joule heating.

Systems

Develop a thermal management system and identify hot spots and thermal stress-related issues that are among the leading field failure risks in electronic systems.