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Sigrity X XtractIM technology leverages hybrid electromagnetic (EM) solvers to create accurate RLC, IBIS, or SPICE models over 10 times faster than traditional methods, supporting system-level signal and power integrity simulations with broadband optimization. Its user-friendly workflow simplifies tasks such as stackup checking and signal/power net selection, making it ideal for both casual and frequent users while quickly identifying potential package performance issues.
产品详情
l Extracts models for an entire package or only selected nets
l Creates ball grid array (BGA), system-in-package (SiP), and leadframe package models
l Supports designs with wirebond and flip-chip die attachment
l Produces standard IBIS models (with or without coupling)
l Generates RLGC models with asymmetric PI or T circuits
l Produces compact broadband models with verifiable full-wave accuracy
l Examines RLC model values as tables and netlists, or as 2D curves and 3D distributions
l Assures broadband model compatibility with time-domain circuit simulation
l Outputs Model Connection Protocol (MCP) and Chip Package Protocol (CPP) for circuit model connection
l Generates HTML format electrical performance assessment report
l Optimized for flows with Allegro X Design Platform, Allegro X Advanced Package Designer Platform, as well as Mentor, Zuken, and AutoCAD flows
成功案例
